HTGB high temperature grid bias test system

• 详细介绍
• 详细参数

• 详细介绍

  The HTGB high temperature grid bias test system is the only dynamic HTGB test system. Its advantages are the software-controlled test process, a large number of test equipment and the flexibility to adjust test parameters. The system uses high voltage changes to stimulate the gate of the device under test in many applications, especially in new technologies. The effect of high voltage changes on device parameters is invisible in the static HTGB test. This kind of dynamic HTGB technology is especially important for new wide bandgap devices such as silicon carbide (SiC) and gallium nitride (GaN).

  This test system provides on-site (in-situ) measurement of the gate threshold voltage. By interrupting the stimulation, switching to the measurement circuit, and then continuing the stimulation fully automatic. The time between stopping stimulation and measurement of each DUT is constant to avoid the influence of different results. Without these precautions, the repeatability and comparability of equipment will be limited.

  Fully automatic measurement replaces the usually required manual measurement reading to save time and cost, while improving the field of view. The measured threshold voltage is divided into Vth (up) and Vth (down), each of which has a configurable preprocessing stage.

  
  

  Test channel:

  Workbench: 10, 20, 40

  Rack (42　U): 　40, 80, 120, 160, 200, 240　DUT:

  
  

  Fully automatic in-situ Vth measurement:

  Measurement interval

  Customizable gate stimulation curve (pretreatment)

  Record measurement data in TDMS file

  
  

  Test parameters:

  Total test time (0-1500h)

  External drain voltage (0V-2000V)

  Hot and cold plate temperature: 20℃-200℃

  Door stimulation V＋　(0V-30V), V－　(-15V－0V)

  Gate frequency (100Hz　－　200kHz)

  Vth measurement interval (10 seconds)

  V measurement voltage curve

  
  

  working principle:

  The set-up test system stimulates the gate with high du/dt to test the influence of these effects.

  The frequency is faster than in the application to speed up the test.

  Using multiple in-situ measurements, trends and drifts are shown.

  
  

  Application background

  • Broadband devices (SiC/GaN) show new effects when exposed to high du/dt.

  • These effects will affect the key characteristics of the DUT, thereby affecting the application

  • Routine testing (H(3)TRB/HTGB) does not have these effects

  •Global standardization organizations are working to release dynamic test standards

  • Participate in the process as part of the German Automotive Semiconductor Working Group (ECPE AQG 324).

  
  

  The dynamic high-temperature gate bias power semiconductor reliability test system adopts a modular design, making its scalability from 40 DUTs to 240 DUTs in a single rack. In this way, effective testing can be carried out in a small footprint.

  DUT is arranged in the drawer every 40 DUT, when used in an application or engineering environment, desktop variants can be provided upon request. This desktop is a small shelf suitable for use in engineering laboratories. It contains a drawer and additional changes to allow more instruments or stimuli to obtain more observation fields, which is very suitable for reliability testing of SiC power devices.

• 详细参数

  Test parameters:

  Total test time (0-1500h)

  Applied drain voltage (0V-2000V)

  Hot and cold plate temperature: 20°C-200°C

  Door stimulation V＋　(0V-30V), V－　(-15V－0V)

  Gate frequency (100Hz　－　200kHz)

  Vth measurement interval (10 seconds)

  V measurement voltage curve

  
  

• 产品特色

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• 详细介绍

  AutoCal系统提供在线的机器人校准方案，旨在快速和自动地保证机械设备的工作性能。因用于机器人各方面应用且与大多数机器人类型兼容，AutoCal系统可以检测出机器人自身构造和工具中心点（TCP）的 突然改变或偏离，并且该系统无需人为干涉就自动地更正这些误差。这意味着不用猜测哪里会出错，不用浪费宝贵时间在机器人程序重复校准上，产品品质无任何损失。

  AutoCal系统-Dynalog的先进水平校准技术，Dynalog是机器人单元标定技术的世界领导者。它的主流产品DynaCal 系统，被应用于离线的机器人单元校准，并作为最精确的和技术先进的机器人校准程序为许多机器人制造商和终端使用者所接受。AutoCal 系统将已证实的DynaCal校准技术结合到一个在线的全自动系统中，该系统专为程序控制和复原而设计的，价格低廉。